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WB200 No-clean Flux
WB200 is a low-VOC halide-free, rosin/resin-free, low solids no-clean flux which provides excellent activity for defect-free soldering. It is formulated with a proper mixture of organic activators which deliver excellent wetting and top-side hold fill, even with OSP coated bare copper boards which have undergone prior thermal excursions.
The formulation ensure to reduce the surface tension between the solder mask and the solder, thereby, dramatically reducing the tendency of solder ball generation. Also, reduce the occurrence of solder bridging.
WB200 is a low-VOC environmental-friendly flux.  Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows. Thermally stable activators provide low solder bridging.

Physical Properties:

Parameters Typical values
Appearance Clear liquid
Odor N/A
Physical stability  Pass: No delamination at 5±2℃  or 45±2℃ 
Solid content 3.5±0.2%
Density 1.013 ± 0.01g/cm3
Acidity 32.0 ± 6.0 mg KOH/g
VOC content 1.5%